Finetech/USA East

(603) 627-8989
https://www.finetechusa.com

Finetech supplies sub-micron accuracy bonders for photonics packaging and assembly -- laser bars, VCSELs, photo diodes, MEMs, sensors, LEDs, flip chip, copper pillar, etc. Our systems provide high process flexibility within one platform - manual, motorized and automated models accommodate thermo-compression / -sonic, eutectic, epoxy, ACF & Indium bonding. Finetech collaborates with customers to understand their complex applications, and deliver a purpose-built solution.