The contract is for advanced semiconductor packaging
BRIDG announced today that it has been awarded a contract by Radiance Technologies, Inc. to develop advanced semiconductor packaging technologies. The three-year agreement has a contract ceiling of $28 million.
The partnership expands the existing collaboration between the two organizations and represents the first of many anticipated projects focused on BRIDG’s heterogeneous integration technology platforms.
“Radiance is pleased to build on our existing relationship with BRIDG by leveraging their digital and analog silicon interposer lines to build state of the art, high mix, low volume microelectronics for the DoD. BRIDG is filling a critical gap in the US microelectronics ecosystem with their advanced system integration and packaging capabilities.”
Dr. Robert Overbeek, Vice President, Radiance Technologies.